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Sapphire polishing slurry （WH series）
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Alumina polishing slurry is designed for C-plane sapphire polishing, and it has a good performance. The removal rate is
high, the surface defects after polishing are decreased, a higher yield can be obtained. Especially in the remove rate, the alumina polishing slurry has a significant increase compared with the previous silica polishing slurry, which is almost two times. Xinanna co. LTD has developed a series of SiC slurry including WH-M1, WH-X1 and WH-B8S.
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Advantage: 1. Good surface quality: surface roughness (Ra<0.3nm). 2. High removal rate (>10μm/h). 3. Long life.
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